Hello…yesterday we announced our new PSB featuring Mobeam technology. Rather than go into details that we’ve covered on the web and in other places, I’ll embed a video of the technology below:
There are a lot of great things with this technology.
- For consumers, no more having to carry around dozens and dozens of loyalty cards
- For consumers, no more having to remember to carry them!
- For consumers, no cost to the technology
- For POS retailers, no hardware changes and no additional costs
- For POS retailers, more use of their loyalty cards due to increased convience
- For brands, more awareness of their products
- For ticket and coupon providers, less printing costs
- For everyone — less waste, less trees and raw materials needed to create cards, less trash!
More information can be found on our web page here.
6 thoughts on “Mobeam and QuickLogic”
How does Mobeam convince a smart phone maker to use the Quicklogic solution?
Does Mobeam have agreements with other chip makers for this same problem?
Thanks for the questions.
For the first: it’s not just Mobeam, but also QuickLogic. Obviously both parties have a vested interest in getting their product sold into smartphone makers, so you can be assured that while Mobeam is out selling the value of their technology (with QuickLogic as one of the companies who can implement it in hardware in the OEM’s system), QuickLogic is hard at work selling the value of our CSSP solutions, which can include the Mobeam technology.
And the second: this technology is not exclusive to QuickLogic. There are other device makers who can implement this technology.
Paul can you comment on a recent interview by the Jeffries analyst with the CEO of Lattice.
LSCC has posted a webcast from a Jefferies conference last week. The CEO is asked specifically about potential competition from QUIK. The Jefferies analyst wanted to understand the fundamental barriers to entry into the ultra low power FPGA market (11:00 mark).
The CEO comments were that he didn’t consider QUIK a real competitor for a couple of reasons:
1) You need to be a big volume manufacturer (Silicon Blue wasn’t) – In dealing with an Apple or Samsung you are dealing with 100’s of millions of units and you have to position 30m-40m of units in inventory before you win. So QUIK wouldn’t even be looked at.
2) QUIK could probably do what they do over time. But they are not on the same technology. LSCC is on 40 going to 28, QUIK is at 90 or something. Going to a sub 2mm die size would be hard for QUIK to get to.
With all respect to their CEO, I believe that our production CSSP shipments to Samsung on their Galaxy Tab 3 7.0 and Galaxy Tab 3 7.0 Lite tablets, as well as Beam 2 smartphone, are proof that we understand exactly what it takes to win business at Samsung. You don’t get three high profile sockets at a company with the prestige and clout of Samsung without being ‘looked at’.
With regards to our process node and die size, I am going to have to again respectfully disagree with his assessment. We aren’t “at 90″ — we are well in advance of that. For our new products, we are on the most correct process node for the markets we serve — that doesn’t always mean the smallest available, but the most cost/size competitive node. We are confident in our current process nodes, as well as our process roadmap.
I think you meant to say “Galaxy TAB…etc
You are correct! Sorry for the confusion.