Announced the strategic partnership with SiFive & the launch of SoC templates
Launched Merced EOS Hardware Development Kit for easy evaluation of EOS platform & Time-Series AI Solution
Launched EOS S3AI SoC Platform for Time Series IoT Endpoint Applications
Acquired SensiML SaaS AI Company
2018
Announced the availability of eFPGA on TSMC 40nm Process
eFPGA solution available for the GLOBALFOUNDRIES 22FDX® (FD-SOI) process
Introduced comprehensive QuickAI Platform for Endpoint AI Applications
2017
Established eFPGA Support Center in Taiwan to Accelerate IP Licensing Model
First to Offer eFPGA Technology on SMIC 40nm Low Leakage Process
2016
Introduced ArcticPro Embedded FPGA (eFPGA)
Joined GLOBALFOUNDRIES FDXcelerator(TM) Partner Program
Shipped 40 Millionth Display Bridge Solution
Introduced EOS S3 Sensor Processing SoC Reference Design Platform
2015
EOS S3 Platform is a multi-core, ultra-low power sensor processing SoC architected for advanced sensor processing functions at a fraction of the power consumption of general purpose microcontroller-based solutions for smartphone, wearable and IoT devices
2014
ArcticLink 3 S2 ultra-low power sensor hub released, offering mobile OEMs significantly increased processing and storage abilities while remaining below the 2% battery power threshold
2013
ArcticLink 3 S1 ultra-low power sensor hub announced, offering mobile OEMs always-on context awareness at < 2% of battery life
PolarPro 3 announced, QuickLogic’s first one-time programmable logic device for mobile and industrial markets
Catalog CSSP product strategy and first solutions announced
2012
ArcticLink III BX display interface bridge announced, offering OEMs a low-cost, flexible solution for bridging incompatible components
2011
ArcticLink III VXannounced, combining display bridging with visual enhancement and power savings technologies
VEE HD+ and HD+ announced, extending the high-quality display experience and battery life savings for smartphonesblets with up to 1,920 x 1,200 displays
2010
ArcticLink II VX nannounced, introducingVEE and providing a high-quality display experience and 25% average battery life extension for smartphones
2008
PolarPro II announced, designed to meet the connectivity, intelligence, security and system logic requirementstable and mobile applications
2007
CSSP Solutions customer engagement model announced; innovative hardware + software solution for mobile and industrial customers
2001
Introduction of embedded processor + programmable logic
1999
October 15 – Initial Public Offering on Nasdaq
1997
Introduction of first hardwired + programmable logic device
1994
Open Tool Synthesis introduced
1991
Introduction of market’s highest performance, lowest power FPGAs
