QuickLogic Timeline
2019
- Announced the strategic partnership with SiFive & the launch of SoC templates
- Launched Merced EOS Hardware Development Kit for easy evaluation of EOS platform & Time-Series AI Solution
- Launched EOS S3AI SoC Platform for Time Series IoT Endpoint Applications
- Acquired SensiML SaaS AI Company
2018
- Announced the availability of eFPGA on TSMC 40nm Process
- eFPGA solution available for the GLOBALFOUNDRIES 22FDX® (FD-SOI) process
- Introduced comprehensive QuickAI Platform for Endpoint AI Applications
2017
- Established eFPGA Support Center in Taiwan to Accelerate IP Licensing Model
- First to Offer eFPGA Technology on SMIC 40nm Low Leakage Process
2016
- Introduced ArcticPro Embedded FPGA (eFPGA)
- Joined GLOBALFOUNDRIES FDXcelerator(TM) Partner Program
- Shipped 40 Millionth Display Bridge Solution
- Introduced EOS S3 Sensor Processing SoC Reference Design Platform
2015
- EOS S3 Platform is a multi-core, ultra-low power sensor processing SoC architected for advanced sensor processing functions at a fraction of the power consumption of general purpose microcontroller-based solutions for smartphone, wearable and IoT devices
2014
- ArcticLink 3 S2 ultra-low power sensor hub released, offering mobile OEMs significantly increased processing and storage abilities while remaining below the 2% battery power threshold
2013
- ArcticLink 3 S1 ultra-low power sensor hub announced, offering mobile OEMs always-on context awareness at < 2% of battery life
- PolarPro 3 announced, QuickLogic’s first one-time programmable logic device for mobile and industrial markets
- Catalog CSSP product strategy and first solutions announced
2012
- ArcticLink III BX display interface bridge announced, offering OEMs a low-cost, flexible solution for bridging incompatible components
2011
- ArcticLink III VXannounced, combining display bridging with visual enhancement and power savings technologies
- VEE HD+ and HD+ announced, extending the high-quality display experience and battery life savings for smartphonesblets with up to 1,920 x 1,200 displays
2010
- ArcticLink II VX nannounced, introducingVEE and providing a high-quality display experience and 25% average battery life extension for smartphones
2008
- PolarPro II announced, designed to meet the connectivity, intelligence, security and system logic requirementstable and mobile applications
2007
- CSSP Solutions customer engagement model announced; innovative hardware + software solution for mobile and industrial customers
2001
- Introduction of embedded processor + programmable logic
1999
- October 15 – Initial Public Offering on Nasdaq
1997
- Introduction of first hardwired + programmable logic device
1994
- Open Tool Synthesis introduced
1991
- Introduction of market’s highest performance, lowest power FPGAs
1988
- Founding of company
- Introduction of ViaLink technology
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